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| TPS850 TOSHIBA Photo-IC Silicon Epitaxial Planar TPS850 Mobile Phones, PHS Notebook PCs, PDAs Video Cameras, Digital Still Cameras Other Equipment Requiring Luminosity Adjustment The TPS850 is a linear-output photo-IC which incorporates a photodiode and a current amp circuit in a single chip. This photo-IC is current output type, so can set up output voltage freely by arbitrary load resistance. * * * * * * High sensitivity: IL = 230 A @EV = 100 lx (typ.) Using the fluorescent light Little fluctuation in light current : Width range = x1 to x1.6 (typ. 25%) Output linearity of illuminance is excellent Open-emitter output Compact and light surface-mount package Lead(Pb)-Free TOSHIBA Weight: 0.017 g (typ.) Absolute Maximum Ratings (Ta = 25C) Characteristics Supply voltage Output voltage Light current Permissible power dissipation Operating temperature range Storage temperature range Soldering temperature range (10 s) (Note 1) Symbol VCC VOUT IL P Topr Tstg Tsol Rating -0.5 to 7 Unit V V mA mW C C C < VCC = 10 70 -30 to 85 -40 to 100 260 Note: Using continuously under heavy loads (e.g. the application of high temperature/current/voltage and the significant change in temperature, etc.) may cause this product to decrease in the reliability significantly even if the operating conditions (i.e. operating temperature/current/voltage, etc.) are within the absolute maximum ratings and the operating ranges. Please design the appropriate reliability upon reviewing the Toshiba Semiconductor Reliability Handbook ("Handling Precautions"/"Derating Concept and Methods") and individual reliability data (i.e. reliability test report and estimated failure rate, etc). Note 1: The reflow time and the recommended temperature profile are shown in the section entitled Handling Precautions. 1 2007-10-01 TPS850 Electrical and Optical Characteristics (Ta = 25C) Characteristics Supply voltage Supply current Light current (1) Light current (2) Light current (3) Symbol VCC ICC IL (1) IL (2) IL (3) Test Condition VCC = 3 V, EV = 1000 lx, (Note 2) RL = 250 VCC = 3 V, EV = 100 lx (Note 2, 4) VCC = 3 V, EV = 10 lx (Note 3, 4) VCC = 3 V, EV = 100 lx (Note 3, 4) Min 2.7 Typ. 4 300 23 230 Max 5.5 Unit V mA 18 180 30 300 A Light current ratio IL (1) IL (3) ILEAK Vo p VCC = 3.3 V, EV = 0 VCC = 3 V, RL = 75 k, EV = 100 lx (Note 3) 1.3 1.7 0.5 A Dark current Saturation output voltage Peak sensitivity wavelength Switching time Rise time Fall time 2.2 2.35 640 0.2 0.35 V nm ms tr tf VCC = 3 V, RL = 5 k, (Note 5) 1 2 Note 2: CIE standard A light source is used (color temperature = 2856K, approximated incandescence light). Note 3: Fluorescence light is used as light source. However, white LED is substituted in a mass-production process. Note 4: Light current measurement circuit VCC Light source TPS850 A IL OUT Note 5: Rise time/fall time measurement method Pulse drive White LED TPS850 VCC OUT RL IF 1.5 V 90% VOUT GND 10% tr tf 2 2007-10-01 TPS850 Package Dimensions Weight: 0.017 g (typ.) Block Diagram 3 VCC Current amp 4 OUT 1 GND 2 GND 3 2007-10-01 TPS850 Handling Precautions At power-on in darkness, the internal circuit takes about 50 ms to stabilize. During this period the output signal is unstable and may change. Please take this into account. Moisture-Proof Packing (1) (2) To avoid moisture absorption by the resin, the product is packed in an aluminum envelope with silica gel. Since the optical characteristics of the device can be affected during soldering by vaporization resulting from prior absorption of moisture and they should therefore be stored under the following conditions: Temperature: 5C to 30C, Relative humidity: 60% (max), Time: 168 h Baking is required if the devices have been store unopened for more than six months or if the aluminum envelope has been opened for more than 168 h. These devices are packed on tapes; hence, please avoid baking at high temperature. Recommended baking conditions: 60C for 12 h or longer (3) Mounting Precautions (1) (2) (3) Do not apply stress to the resin at high temperature. The resin part is easily scratched, so avoid friction with hard materials. When installing the assembly board in equipment, ensure that this product does not come into contact with other components. Mounting Methods (1) Reflow soldering * Package surface temperature: 260C (max) * Please perform reflow soldering using the following reference temperature profile. Perform reflow soldering no more than twice. Temperature (C) 260C max 230C 190C 180C Preheating part 60 s to 120 s 30 s to 50 s Heating part Time (s) * * Please perform the first reflow soldering within 168 h after opening the package with reference to the above temperature profile. Second reflow soldering In case of second reflow soldering, it should be performed within 168 h after first reflow under the above conditions. Storage conditions before second reflow soldering: 30C, 60% RH or lower * * Do not perform flow soldering. Make any necessary soldering correction manually. (do not do this more than once for any given pin.) Temperature: no more than 350C (25 W for soldering iron) Time: within 5 s 4 2007-10-01 TPS850 (2) Recommended soldering pattern 1.6 1.3 1.6 Unit: mm (3) Cleaning conditions When cleaning is required after soldering Chemicals: AK225 alcohol Temperature and time: 50C x 30 s or : 30C x 3 minutes Ultrasonic cleaning: 300 W or less Packing Specification (1) Packing quantity Reel (minimum packing quantity) Carton 3000 devices 5 reels (15000 devices) (2) Packing format An aluminum envelope containing silica gel and reels is deaerated and sealed. Pack shock-absorbent materials around the aluminum envelopes in the cartons to cushion them. * Carton specification 0.95 0.6 0.95 Label Carton dimensions (W) 81 mm x (L) 280 mm x (H) 280 mm 5 2007-10-01 TPS850 Tape Packing Specifications (1) Reel dimensions 11.4 1 9 0.3 +0 180 - 4 21 0.3 13 0.5 2 0.5 Label (2) Tape dimensions 4.0 0.1 + 0.1 1.5 0 60 2.0 0.05 A 1.75 0.1 0.2 0.05 max 6 max 6 3.5 0.1 8.0 0.2 B B' 4.0 0.1 (2.75) 3.6 0.1 Device Orientation Feed direction 1.3 0.1 A-A' A' 2.8 0.1 max 6 max 6 B-B' (3) Packing quantity: 3000/reel 6 2007-10-01 TPS850 P - Ta 80 70 10 ILEAK - Ta VCC = 3 V Please refer to Figure 2. (typ.) Power dissipation P (mW) Dark current ILEAK (A) 60 50 40 30 20 10 0 0 1 0.1 0.01 20 40 60 80 100 0.001 20 40 60 80 100 Ambient temperature Ta (C) Ambient temperature Ta (C) IL - EV 10000 (typ.) 1.4 Relative VCC = 3 V Please refer to Figure 1. Fluorescent light A light source IL - Ta (typ.) Light current IL (A) 1000 1.2 100 Relative light current 1.0 10 1 1 Ta = 25C VCC = 3 V Please refer to Figure 1. A light source Fluorescent light 10 100 1000 10000 0.8 0.6 -40 -20 0 20 40 60 80 100 Illuminance EV (lx) Ambient temperature Ta (C) Relative 1.6 IL - VCC (typ.) 10 Vo - EV Ta = 25C VCC = 3 V Please refer to Figure 4. (typ.) 1 Output voltage Vo (V) 1.2 Relative light current 0.1 0.8 0.01 0.4 0.001 Ta = 25C Please refer to Figure 1. 3 4 5 6 7 Fluorescent light Fluorescent light A light source A light source 10 100 1000 0 2 0.0001 1 RL = 250 RL = 5 k RL = 250 RL = 5 k 10000 Supply voltage VCC (V) Illuminance EV (lx) 7 2007-10-01 TPS850 ICC - EV 10 3 (typ.) 1.40 Relative ICC - Ta VCC = 3 V Using the Fluorescent light RL = 1 k Please refer to Figure 3. (typ.) (mA) Relative consumption current 1 0.3 0.1 0.03 0.01 0.003 0.001 1 Ta = 25C VCC = 3 V Using the A light source Please refer to Figure 3. RL = 250 RL = 1000 RL = 5000 10 100 1000 10000 1.20 Consumption current ICC 1.00 0.80 0.60 -40 -20 0 20 40 60 80 100 Illuminance EV (lx) Ambient temperature Ta (C) Switching characteristics (Non-saturating operation) 1000 Ta = 25C VCC = 3 V VOUT = 1.5 V Using the White LED Please refer to Figure 5. (typ.) 1000 Switching characteristics (Saturating operation) Ta = 25C VCC = 3 V VOUT > 2 V = Using the White LED Please refer to Figure 5. (typ.) 300 300 100 100 tf tf Switching time (s) Switching time (s) 30 td 30 td ts 10 tr 10 3 3 tr 1 1 0.3 ts 0.3 0.1 0.1 0.3 1 3 10 0.1 0.1 0.3 1 3 10 Load resistance RL (k) Load resistance RL (k) 8 2007-10-01 TPS850 Spectral response 1 Ta = 25C 0.8 (typ.) Radiation pattern (typ.) Ta = 25C Luminosity angle 20 30 40 10 0 10 20 30 40 50 60 70 80 90 1.0 Relative sensitivity 0.6 0.4 60 0.2 70 80 0 200 90 50 400 600 800 1000 1200 0 0.2 0.4 0.6 0.8 Wavelength (nm) Relative sensitivity Measurement Circuits VCC Light TPS850 A IL OUT TPS850 A VCC ILEAK OUT Figure 1 Light current measurement circuit Figure 2 Dark current measurement circuit Icc Light TPS850 RL A VCC OUT VCC Light TPS850 RL V Vo Figure 3 Consumption current measurement circuit Figure 4 Output voltage measurement circuit IF Pulse drive White LED TPS850 RL VCC OUT VOUT GND Figure 5 10% tr tf td 1.5 V ts 90% Switching measurement circuit and waveform 9 2007-10-01 TPS850 RESTRICTIONS ON PRODUCT USE * The information contained herein is subject to change without notice. 20070701-EN GENERAL * TOSHIBA is continually working to improve the quality and reliability of its products. Nevertheless, semiconductor devices in general can malfunction or fail due to their inherent electrical sensitivity and vulnerability to physical stress. It is the responsibility of the buyer, when utilizing TOSHIBA products, to comply with the standards of safety in making a safe design for the entire system, and to avoid situations in which a malfunction or failure of such TOSHIBA products could cause loss of human life, bodily injury or damage to property. In developing your designs, please ensure that TOSHIBA products are used within specified operating ranges as set forth in the most recent TOSHIBA products specifications. Also, please keep in mind the precautions and conditions set forth in the "Handling Guide for Semiconductor Devices," or "TOSHIBA Semiconductor Reliability Handbook" etc. * The TOSHIBA products listed in this document are intended for usage in general electronics applications (computer, personal equipment, office equipment, measuring equipment, industrial robotics, domestic appliances, etc.).These TOSHIBA products are neither intended nor warranted for usage in equipment that requires extraordinarily high quality and/or reliability or a malfunction or failure of which may cause loss of human life or bodily injury ("Unintended Usage"). Unintended Usage include atomic energy control instruments, airplane or spaceship instruments, transportation instruments, traffic signal instruments, combustion control instruments, medical instruments, all types of safety devices, etc.. Unintended Usage of TOSHIBA products listed in his document shall be made at the customer's own risk. * The products described in this document shall not be used or embedded to any downstream products of which manufacture, use and/or sale are prohibited under any applicable laws and regulations. * The information contained herein is presented only as a guide for the applications of our products. No responsibility is assumed by TOSHIBA for any infringements of patents or other rights of the third parties which may result from its use. No license is granted by implication or otherwise under any patents or other rights of TOSHIBA or the third parties. * Please contact your sales representative for product-by-product details in this document regarding RoHS compatibility. Please use these products in this document in compliance with all applicable laws and regulations that regulate the inclusion or use of controlled substances. Toshiba assumes no liability for damage or losses occurring as a result of noncompliance with applicable laws and regulations. 10 2007-10-01 |
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